公开(公告)号：US20240305452A1

公开(公告)日：2024-09-12

申请号：US18181429

申请日：2023-03-09

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Joseph Wright ,  Christopher J. Davenport

IPC: H04L9/08

CPC classification number: H04L9/085 ,  H04L9/0869 ,  H04L9/0877

Abstract: A process includes providing a first signal to a first conductive mesh of a semiconductor package to provide a wireless transmission, and receiving, by a second conductive mesh of the semiconductor package, the wireless transmission to provide a second signal. The process includes determining a signature of the second signal and generating, by a cryptographic security parameter generator of the semiconductor package, a cryptographic security parameter based on the signature.