MODULAR SERVER ARCHITECTURES
    1.
    发明申请

    公开(公告)号:US20190373754A1

    公开(公告)日:2019-12-05

    申请号:US16000791

    申请日:2018-06-05

    Abstract: Examples relate to a modular server architecture that comprises a server chassis, a plurality of independent resource modules releasable attached to the server chassis a memory semantic protocol controller connected to the plurality of independent resource modules. Each one of the resource modules of the plurality of resource modules has a distinct Printed Circuit Board (PCB). The memory semantic media controller is to manage the plurality of independent resource modules.

    Modular server design
    2.
    发明授权

    公开(公告)号:US11051422B2

    公开(公告)日:2021-06-29

    申请号:US16131441

    申请日:2018-09-14

    Abstract: A modular compute platform including an enclosure, a first module including an application specific integrated circuit, the first module being disposed in the enclosure, a second module including an input/output device, the second module being disposed in the enclosure, the input/output device connected to the first module through a first cable, and a third module including a media device disposed in the enclosure, the media device connected to the first module through a second cable.

    Modular server architectures
    3.
    发明授权

    公开(公告)号:US10820442B2

    公开(公告)日:2020-10-27

    申请号:US16000791

    申请日:2018-06-05

    Abstract: Examples relate to a modular server architecture that comprises a server chassis, a plurality of independent resource modules releasable attached to the server chassis a memory semantic protocol controller connected to the plurality of independent resource modules. Each one of the resource modules of the plurality of resource modules has a distinct Printed Circuit Board (PCB). The memory semantic media controller is to manage the plurality of independent resource modules.

    MODULAR SERVER DESIGN
    4.
    发明申请

    公开(公告)号:US20200093021A1

    公开(公告)日:2020-03-19

    申请号:US16131441

    申请日:2018-09-14

    Abstract: A modular compute platform including an enclosure, a first module including an application specific integrated circuit, the first module being disposed in the enclosure, a second module including an input/output device, the second module being disposed in the enclosure, the input/output device connected to the first module through a first cable, and a third module including a media device disposed in the enclosure, the media device connected to the first module through a second cable.

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