公开(公告)号：US20170315298A1

公开(公告)日：2017-11-02

申请号：US15520829

申请日：2014-10-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Terrel L MORRIS ,  Raymond G BEAUSOLEIL ,  Jason PELC, SR. ,  Marco FIORENTINO ,  Charles M SANTORI ,  Michael W CUMBIE

IPC: G02B6/30 ,  G02B6/36

Abstract: One example includes an optical fiber interface. The interface includes a first substrate comprising a pair of opposing surfaces. The substrate includes an opening extending therethrough that defines an inner periphery. One surface of the opposing surfaces of the first substrate can be configured to be bonded to a given surface of a second substrate. The interface also includes a plurality of optical fibers secured to the other opposing surface of the first substrate and extending inwardly from a plurality of surfaces of the inner periphery at fixed locations to align the set of optical fibers to optical inputs/outputs (I/O) of an optical system chip that is coupled to the given surface of the second substrate and received through the opening.