公开(公告)号：US11521908B2

公开(公告)日：2022-12-06

申请号：US16930877

申请日：2020-07-16

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Sunil Rao Ganta Papa Rao Bala ,  Matthew Kielbasa ,  Harvey Edward White, Jr.

IPC: H01L23/367 ,  H01L23/34 ,  H01L23/04

Abstract: Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.

公开(公告)号：US20220020660A1

公开(公告)日：2022-01-20

申请号：US16930877

申请日：2020-07-16

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Sunil Rao Ganta Papa Rao Bala ,  Matthew Kielbasa ,  Harvey Edward White, JR.

IPC: H01L23/367 ,  H01L23/34

Abstract: Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.