公开(公告)号：US20190069423A1

公开(公告)日：2019-02-28

申请号：US15686595

申请日：2017-08-25

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Robert Eugene Cayou

IPC: H05K5/02 ,  H05K5/04 ,  H05K1/02 ,  H05K7/14

Abstract: Examples herein relate to an integrated stand-off for a printed circuit board (PCB), the integrated stand-off comprises a metal grounding contact stamped on a first surface of a sheet metal chassis and a plastic element overmolded on the metal grounding contact. The metal grounding contact is encased with the plastic element.

公开(公告)号：US20190053398A1

公开(公告)日：2019-02-14

申请号：US15675211

申请日：2017-08-11

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Robert Eugene Cayou ,  Vance Murakami ,  Paul Wes Stelter ,  Eugene Yan Ki Hsue

IPC: H05K7/18 ,  H05K7/14

Abstract: Examples relate to sliding rail assemblies comprising a first and a second slide rail wherein each slide rail comprises a main body and a guide rail. The main body has an inner surface to attach to an inner surface of the guide rail and an outer surface having an upper, a lower and a middle protrusion along the length of the main body. The upper and the middle protrusions define a dovetail socket and the middle and the lower protrusion define a dovetail. The main bodies of the first and the second slide rails are identical to each other. Each dovetail protrusion of the first slide rail slidably engages a corresponding dovetail protrusion of the second slide rail such that a cavity is formed between the respective guide rails. The upper protrusion of the first slide rail slidably engages the lower protrusion of the second slide rail, the lower protrusion of the first slide rail slidably engages the upper protrusion of the second slide rail and the middle protrusion of the first and second slide rails engages to each other.

公开(公告)号：US10959343B2

公开(公告)日：2021-03-23

申请号：US15686595

申请日：2017-08-25

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Robert Eugene Cayou

IPC: H05K5/02 ,  H05K5/04 ,  H05K1/02 ,  H05K7/14

Abstract: An integrated stand-off for a printed circuit board (PCB), and methods of making the integrated stand-off, and mounting such integrated stand-off to the PCB are disclosed. The integrated stand-off includes a metal grounding contact and a plastic element. The metal grounding contact is stamped on a first surface of a sheet metal chassis and the plastic element is overmolded on the metal grounded contact. The metal grounding contact is completely encased within the plastic element to distance the sheet metal chassis from contacting the PCB for preventing electrical shorts there between.

公开(公告)号：US10271454B2

公开(公告)日：2019-04-23

申请号：US15675211

申请日：2017-08-11

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Robert Eugene Cayou ,  Vance Murakami ,  Paul Wes Stelter ,  Eugene Yan Ki Hsue

IPC: H05K7/00 ,  H05K7/18 ,  H05K7/14

Abstract: Examples relate to sliding rail assemblies comprising a first and a second slide rail wherein each slide rail comprises a main body and a guide rail. The main body has an inner surface to attach to an inner surface of the guide rail and an outer surface having an upper, a lower and a middle protrusion along the length of the main body. The upper and the middle protrusions define a dovetail socket and the middle and the lower protrusion define a dovetail. The main bodies of the first and the second slide rails are identical to each other. Each dovetail protrusion of the first slide rail slidably engages a corresponding dovetail protrusion of the second slide rail such that a cavity is formed between the respective guide rails. The upper protrusion of the first slide rail slidably engages the lower protrusion of the second slide rail, the lower protrusion of the first slide rail slidably engages the upper protrusion of the second slide rail and the middle protrusion of the first and second slide rails engages to each other.

公开(公告)号：US20190090375A1

公开(公告)日：2019-03-21

申请号：US15708774

申请日：2017-09-19

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Eugene Yan Ki Hsue ,  Harold Zin Htutt ,  Robert Eugene Cayou ,  Vance Murakami

IPC: H05K7/14

Abstract: Examples herein relate to a keying device for inserting a module in a chassis. The device comprises a key plate having a protrusion adapted to interlock with a slot of the chassis and teeth to grip the module and an operating handle. The keying device permits insertion or ejection of the module in the chassis responsive to the protrusion interlocking the slot of the chassis when the operating handle is in an open position and the keying device rejects insertion or ejection of the module in the chassis responsive to the protrusion not interlocking the slot of the chassis when the operating handle is in a closed position.