公开(公告)号：US11648773B2

公开(公告)日：2023-05-16

申请号：US17414413

申请日：2019-09-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Vincent C. Korthuis ,  Huyen Pham ,  Tsuyoshi Yamashita

IPC: B41J2/14

CPC classification number: B41J2/1404

Abstract: In example implementations, a printhead die is provided. The printhead die includes a substrate, a chamber layer formed on the substrate, a plurality of printing fluid ejection chambers coupled to opposite sides of the chamber layer and along a length of the chamber layer, and a top hat layer formed on the chamber layer and the plurality of printing fluid ejection chambers. The chamber layer includes a void to store printing fluid. The top hat layer includes an initial unsupported top hat layer portion over the void, wherein the initial unsupported top hat layer portion comprises a first end that is narrower than a second end.

公开(公告)号：US09776402B2

公开(公告)日：2017-10-03

申请号：US15111269

申请日：2014-01-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Lawrence H. White ,  Anthony M. Fuller ,  Huyen Pham

IPC: B41J2/14 ,  B41J2/335 ,  B41J2/16

CPC classification number: B41J2/14112 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/3357

Abstract: The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.

公开(公告)号：US12240237B2

公开(公告)日：2025-03-04

申请号：US18123134

申请日：2023-03-17

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Vincent C. Korthuis ,  Huyen Pham ,  Tsuyoshi Yamashita

IPC: B41J2/14 ,  H01H85/02

Abstract: In example implementations, a printhead die is provided. The printhead die includes a substrate, a chamber layer formed on the substrate, a plurality of printing fluid ejection chambers coupled to opposite sides of the chamber layer and along a length of the chamber layer, and a top hat layer formed on the chamber layer and the plurality of printing fluid ejection chambers. The chamber layer includes a void to store printing fluid. The top hat layer includes an initial unsupported top hat layer portion over the void, wherein the initial unsupported top hat layer portion comprises a first end that is narrower than a second end.

公开(公告)号：US20160325547A1

公开(公告)日：2016-11-10

申请号：US15111269

申请日：2014-01-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Lawrence H. White ,  Anthony M. Fuller ,  Huyen Pham

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14112 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/3357

Abstract: The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.

Abstract translation: 本公开包括一种制造热喷墨打印头的方法，包括沉积具有厚度的第一金属层以形成电源总线，去除第一电介质层，在第一电介质层中形成通孔以将第一金属层连接到 第二金属层，沉积第二金属层，沉积电阻层，在电阻层中形成热电阻，沉积第二电介质层，以及去除第二电介质层的一部分。

公开(公告)号：US20230230790A1

公开(公告)日：2023-07-20

申请号：US18123134

申请日：2023-03-17

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Vincent C. Korthuis ,  Huyen Pham ,  Tsuyoshi Yamashita

IPC: H01H85/02

CPC classification number: H01H85/0241 ,  H01H2085/0266 ,  H01H2085/0275 ,  H01H2085/0291

Abstract: In example implementations, a printhead die is provided. The printhead die includes a substrate, a chamber layer formed on the substrate, a plurality of printing fluid ejection chambers coupled to opposite sides of the chamber layer and along a length of the chamber layer, and a top hat layer formed on the chamber layer and the plurality of printing fluid ejection chambers. The chamber layer includes a void to store printing fluid. The top hat layer includes an initial unsupported top hat layer portion over the void, wherein the initial unsupported top hat layer portion comprises a first end that is narrower than a second end.

公开(公告)号：US20220184946A1

公开(公告)日：2022-06-16

申请号：US17414413

申请日：2019-09-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Vincent C. Korthuis ,  Huyen Pham ,  Tsuyoshi Yamashita

IPC: B41J2/14

Abstract: In example implementations, a printhead die is provided. The printhead die includes a substrate, a chamber layer formed on the substrate, a plurality of printing fluid ejection chambers coupled to opposite sides of the chamber layer and along a length of the chamber layer, and a top hat layer formed on the chamber layer and the plurality of printing fluid ejection chambers. The chamber layer includes a void to store printing fluid. The top hat layer includes an initial unsupported top hat layer portion over the void, wherein the initial unsupported top hat layer portion comprises a first end that is narrower than a second end.