公开(公告)号：US11760025B2

公开(公告)日：2023-09-19

申请号：US17311973

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wojciech Jerzy Krasowski ,  Arturo Garcia Gomez ,  Josep Maria Fernandez Sanjuan

IPC: B33Y30/00 ,  B29C64/379 ,  B33Y40/00 ,  B29C64/245 ,  B29C64/255

CPC classification number: B29C64/379 ,  B29C64/245 ,  B29C64/255 ,  B33Y30/00 ,  B33Y40/00

Abstract: A platform is moved to translate contents of a print chamber to a secondary chamber. Negative pressure is applied to the secondary chamber and print chamber during motion of the platform, to reduce friction between the contents of the print chamber and sidewalls of the print chamber.

公开(公告)号：US20220055306A1

公开(公告)日：2022-02-24

申请号：US17309760

申请日：2019-04-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Ernesto Alejandro Jones Poppescou ,  Wojciech Jerzy Krasowski ,  Arturo Garcia Gomez ,  Josep Maria Fernandez Sanjuan

IPC: B29C64/364 ,  B33Y30/00 ,  B33Y40/20

Abstract: A cooling unit can be coupled to a build unit of a 3D printing system. The cooling unit comprises a cooling unit opening which is arranged to face a build unit opening when the cooling unit is coupled to the build unit to enable transfer of content from the build unit to the cooling unit. The cooling unit further comprises a self-locking latch mechanism to couple the cooling unit to the build unit such that the cooling unit opening faces the build unit opening.