公开(公告)号：US20200298489A1

公开(公告)日：2020-09-24

申请号：US16608859

申请日：2017-12-11

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Mayid Shawi ,  Pedro Garcia ,  Michele Vergani

IPC: B29C64/30 ,  B29C64/153 ,  B29C64/20 ,  B33Y10/00 ,  B33Y30/00

Abstract: Examples of the present disclosure relate to a method of cooling objects produced by an additive manufacturing process. The method comprises obtaining a volume of build material output from the additive manufacturing process. The volume of build material comprises unsolidified build material. The volume of build material comprises a plurality of objects and a separating element between the plurality of objects, the objects and the separating element having been produced by sequentially depositing layers of build material and the separating element having been produced based on at least one of the plurality of objects. The method comprises applying gas to the volume of build material to cool the plurality of objects, wherein the separating element provides a barrier between the plurality of objects during the applying of the gas to the volume of build material.

公开(公告)号：US20200307098A1

公开(公告)日：2020-10-01

申请号：US16605605

申请日：2017-12-22

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Juan Manuel Zamorano ,  Mayid Shawi ,  Vicente Granados

IPC: B29C64/386 ,  H05K1/16 ,  H05K3/12

Abstract: Certain examples relate to encoding data into three-dimensional objects. In one case, a location of a set of terminals to be accessed on an outer surface of the object after fabrication is determined. A mapping between data to be encoded and an electrical property to be measured via a conductive coupling and an embedded electrical structure with the electrical property are determined. Control data is generated to instruct the fabrication of the object with the set of terminals and the embedded electrical structure.