公开(公告)号：USD962225S1

公开(公告)日：2022-08-30

申请号：US29729899

申请日：2020-03-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Designer： Stacy L. Wolff ,  Eric Chen ,  Chad Patrick Paris ,  Woojin Chung ,  David Lee

公开(公告)号：US20230034118A1

公开(公告)日：2023-02-02

申请号：US17790815

申请日：2020-02-04

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Stacy L. Wolff ,  Eric Wright Chen ,  Ilchan Lee ,  Chad Patrick Paris ,  Woojin Chung

IPC: G06F1/16

Abstract: An example electronic device includes a first housing having a first cover and a second cover, where the first cover is made from fibre composite material, where the second cover is made from metal, and where the first cover is bonded to the second cover via adhesive. The electronic device also includes a display device disposed in the first housing.

公开(公告)号：USD890165S1

公开(公告)日：2020-07-14

申请号：US29641836

申请日：2018-03-26

Applicant: Hewlett-Packard Development Company, L.P.

Designer： Stacy L. Wolff ,  Eric Chen ,  Chad Patrick Paris ,  Woojin Chung ,  David Lee

公开(公告)号：USD914675S1

公开(公告)日：2021-03-30

申请号：US29661195

申请日：2018-08-24

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Designer： Stacy L. Wolff ,  Eric Chen ,  Chad Patrick Paris ,  Woojin Chung ,  Albee Lin

公开(公告)号：USD888707S1

公开(公告)日：2020-06-30

申请号：US29646481

申请日：2018-05-04

Applicant: Hewlett-Packard Development Company, L.P.

Designer： Stacy L. Wolff ,  Eric Chen ,  Chad Patrick Paris ,  Merrill Mathew ,  Woojin Chung ,  Ruey-Jin Wong ,  Jeffrey Liu

公开(公告)号：US20240184331A1

公开(公告)日：2024-06-06

申请号：US18554323

申请日：2021-04-20

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kenneth Maclean ,  Chad Patrick Paris ,  Woojin Chung ,  Stacy L. Wolff ,  Eric Chen ,  Oliver Poyntz ,  Marcus Hoggarth ,  Benjamin Carroll

IPC: G06F1/16

CPC classification number: G06F1/1632 ,  G06F1/1681

Abstract: An example system includes a peripheral device including a first contact surface, and an electronic device including a housing, a second contact surface aligned with a surface of the housing, and a hinge coupled to the second contact surface. The second contact surface is to pivot into the housing about the hinge in response to an engagement with the first contact surface of the peripheral device.