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公开(公告)号：US20220267543A1
公开(公告)日：2022-08-25
申请号：US17625157
申请日：2020-07-19
Applicant: HEXCEL COMPOSITES LIMITED
Inventor： Mark WHITER , Ben TIPLER , Mathilde MAILLOT
Abstract: A prepreg or semipreg precursor comprising a fibre reinforcement and a resin composition fused thereto, the resin composition containing at least one epoxy resin and a latent curing agent, wherein the epoxy resin and the latent curing agent form a solid phase at ambient temperature, the latent curing agent forming a discrete phase within the epoxy resin. The stabilized uncured resin composition and prepregs and semipregs incorporating the same are easy to handle, have desirable curing temperatures and show good outlife at ambient to mid range temperatures.
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