DEFECT INSPECTION DEVICE AND DEFECT INSPECTION METHOD

    公开(公告)号:US20170328864A1

    公开(公告)日:2017-11-16

    申请号:US15528013

    申请日:2014-11-28

    Applicant: HITACHI, LTD.

    CPC classification number: G01N27/9046 G01N27/83

    Abstract: A defect inspection device configured to measure a surface shape of an inspection target using light applied to the inspection target via a spatial light phase modulator based on an interference state of reflected light from the inspection target obtained via the spatial light phase modulator, to measure magnetic field distribution of a surface of the inspection target magnetized by an excitation device for magnetizing the inspection target using light applied to the inspection target via the spatial light phase modulator based on an interference state of reflected light from the inspection target obtained via the spatial light phase modulator, and to separate data of a magnetic field specific portion which exists on the surface of the inspection target from magnetic field distribution data which is a measurement result of magnetic field distribution of the inspection target based on surface shape data which is a measurement result of the surface shape of the inspection target, to suppress deterioration of measurement accuracy of magnetic field distribution generated by the surface shape of the inspection target and to improve defect detection accuracy.

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