公开(公告)号：US12245384B2

公开(公告)日：2025-03-04

申请号：US17622174

申请日：2020-05-13

Applicant: HITACHI ASTEMO, LTD.

Inventor： Yuki Nakamura ,  Masahiro Toyama ,  Isao Hoda ,  Hiroki Funato ,  Umberto Paoletti ,  Hideyuki Sakamoto ,  Yutaka Uematsu

IPC: H05K1/18 ,  H05K5/00 ,  H05K9/00

Abstract: A signal transmission circuit includes: a circuit board stored in a housing; a connector which is mounted on the circuit board and includes a first signal terminal and a first ground terminal; and an integrated circuit which is mounted on the circuit board and includes a second signal terminal and a second ground terminal. The first signal terminal and the second signal terminal are connected to each other by a signal wiring arranged on the circuit board. The first around terminal and the second ground terminal are connected to each other by a ground wiring arranged in a predetermined range including a portion immediately above or immediately below the signal wiring in the circuit board. At least a part of the ground wiring immediately above or immediately below the signal wiring has a high impedance structure formed to be wider than the signal wiring and narrower than a combined width of the first signal terminal and the first ground terminal.