公开(公告)号：US20140069564A1

公开(公告)日：2014-03-13

申请号：US13784253

申请日：2013-03-04

申请人： HITACHI HIGH-TECH INSTRUMENTS CO., LTD.

发明人： Ryuichi TAKANO ,  Naoki OKAMOTO

IPC分类号： H01L23/00

CPC分类号： H01L24/74 ,  H01L24/75 ,  H01L2224/75317 ,  Y10T156/10

摘要： The present invention provides a bonding device and a bonding method with a high operation ratio by solving the problems of conventional techniques.In the present invention, a collet holder grasping a used collet is inserted from a first opening portion with the upper face open; the used collet is engaged with first engagement portions provided at the first opening portion of a discarding unit; the used collet is removed from the collet holder to be discarded by lifting the collet holder; the collet holder is inserted from a second opening portion with the upper face open of a supplying unit; the uppermost unused collet among plural stacked unused collets is grasped; and the uppermost unused collet ejected from the first opening portion is attached to the collet holder.

摘要翻译： 本发明通过解决现有技术的问题提供了具有高操作比的接合装置和接合方法。 在本发明中，夹持使用过的夹头的夹头架从上面打开的第一开口部插入， 使用过的夹头与设置在废弃单元的第一开口部的第一接合部接合; 使用过的夹头从夹头夹持器中取出，通过提起夹头固定器而被丢弃; 夹头保持器从供给单元的上表面打开的第二开口部插入; 掌握多个堆叠的未使用的夹头中最上面的未使用夹头; 并且从第一开口部分排出的最上面未使用的夹头附接到夹头保持器。