公开(公告)号：US20190185181A1

公开(公告)日：2019-06-20

申请号：US15847071

申请日：2017-12-19

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Anita Sure ,  Raghuveer Hanumanthrao Desai ,  Bharath Kumar Kabbur ,  Sunit Kumar Saxena

IPC: B64D47/04 ,  F21V7/04 ,  F21V29/51

CPC classification number: B64D47/04 ,  F21V7/041 ,  F21V29/51 ,  F21Y2105/18 ,  F21Y2115/10

Abstract: A lighting device for a vehicle. The lighting device has a PAR form fit, and includes a housing with a circumferential wall. The circumferential wall has an inner surface, an outer surface and an opening for light emission. The device includes a plurality of light emitting semiconductor devices. The plurality of light emitting semiconductor devices are mounted on a surface of a substrate such that the peak emitted light intensity direction of each one of the plurality of light emitting semiconductor devices is directed toward the central axis. A second surface of the substrate is in thermal contact with the inner surface of the circumferential wall. The device also includes a plurality of curved reflecting surfaces arranged between the plurality of light emitting semiconductor devices and the central axis, arranged to reflect light emitted by the plurality of light emitting semiconductor devices through the opening.

公开(公告)号：US10343792B1

公开(公告)日：2019-07-09

申请号：US15847071

申请日：2017-12-19

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Anita Sure ,  Raghuveer Hanumanthrao Desai ,  Bharath Kumar Kabbur ,  Sunit Kumar Saxena

IPC: B64D47/02 ,  B64D47/04 ,  F21V7/04 ,  F21V29/51 ,  F21Y105/18 ,  F21Y115/10

Abstract: A lighting device for a vehicle. The lighting device has a PAR form fit, and includes a housing with a circumferential wall. The circumferential wall has an inner surface, an outer surface and an opening for light emission. The device includes a plurality of light emitting semiconductor devices. The plurality of light emitting semiconductor devices are mounted on a surface of a substrate such that the peak emitted light intensity direction of each one of the plurality of light emitting semiconductor devices is directed toward the central axis. A second surface of the substrate is in thermal contact with the inner surface of the circumferential wall. The device also includes a plurality of curved reflecting surfaces arranged between the plurality of light emitting semiconductor devices and the central axis, arranged to reflect light emitted by the plurality of light emitting semiconductor devices through the opening.