公开(公告)号：US10806054B1

公开(公告)日：2020-10-13

申请号：US16533234

申请日：2019-08-06

Applicant: HONEYWELL INTERNATIONAL INC.

Inventor： Saravanakumar Mahalingam ,  NSV Sarveswara Sarma A ,  D Chandra Mohan Vyas ,  Ravi Radhakrishnan ,  Mathews Kuriakose

IPC: H05K7/20 ,  H05K7/14 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic subassembly includes an enclosure, a circuit board, a plurality of electronic components, and a plurality of flexible elastic thermal elements. Each flexible elastic thermal bridge is disposed in the gap between a different one of the electronic components and a first wall of the enclosure. Each flexible elastic thermal bridge includes a first thermally conductive metallic structure, a second thermally conductive metal structure, and an elastically deflectable thermal element. The first thermally conductive metallic structure contacts the first wall. The second thermally conductive metallic structure contacts the top surface of the electronic component and is spaced apart from the first thermally conductive metallic structure to define a void. The elastically deflectable thermal element is disposed in the void and directly contacts both the first thermally conductive metallic structure and the second thermally conductive metallic structure. The elastically deflectable thermal element comprises at least one thermally conductive material.