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    METHOD OF FORMING REFRIGERANT SYSTEMS
    2.
    发明公开
    METHOD OF FORMING REFRIGERANT SYSTEMS 审中-公开

    公开(公告)号：US20240278362A1

    公开(公告)日：2024-08-22

    申请号：US18444805

    申请日：2024-02-19

    申请人： HONEYWELL INTERNATIONAL INC.

    发明人： Nilesh Purohit ,  Kaimi Gao ,  Ronald Vogl ,  Ankit Sethi ,  Ryan Hulse

    IPC分类号： B23P15/26 ,  F25B1/00

    CPC分类号： B23P15/26 ,  F25B45/00 ,  F25B1/00

    摘要： Methods for forming an improved refrigeration system comprising: (a) providing an existing refrigeration circuit comprising an existing refrigerant having a GWP of greater than 1200, a plurality of evaporators in a refrigerated space containing products accessible to consumers, a rack of compressors and at least one condenser located remotely from the areas accessible to consumers; (b) disconnecting the fluid connection between the existing liquid refrigerant from said condenser and said evaporators; (c) disconnecting the fluid connection between said existing refrigerant vapor from said evaporators in step (b) and said suction of said compressor or compressor rack; and (d) establishing a new first refrigeration circuit comprising the compressor rack and said condenser; (e) establishing a new second refrigeration circuit comprising at least one of the evaporators by steps comprising: (i) removing the existing refrigerant from the evaporators and at least a portion of said conduits which have been disconnected in steps (b) and (c); and (ii) replacing the removed existing refrigerant with a second refrigerant comprising: (1) from about 30 to about 70% by weight of CF3I; (2) from about 9% to about 58% by weight of HFO-1234yf; (3) from 1% to about 21.5% by weight of HFC-32; and optionally (4) from 0.5% to 4% by weight of HFC-125, CO2 or a combination of HFC-125 and CO2.

    HEAT TRANSFER COMPOSITIONS, METHODS, AND SYSTEMS
    7.
    发明申请
    HEAT TRANSFER COMPOSITIONS, METHODS, AND SYSTEMS 有权

    公开(公告)号：US20220243106A1

    公开(公告)日：2022-08-04

    申请号：US17591375

    申请日：2022-02-02

    申请人： HONEYWELL INTERNATIONAL INC.

    发明人： Ankit Sethi ,  Kaimi Gao ,  Samuel Yana Motta

    IPC分类号： C09K5/04

    摘要： The present invention relates to a refrigerant composition comprising at least about 98.5% by weight of the following three compounds, with each compound being present in the following relative percentages: 16.5% to 21.5% by weight difluoromethane (HFC-32); 68.5% to 80.5% by weight of 2,3,3,3-tetrafluoropropene (HFO-1234yf); and 3.0% to 10.0% by weight fluoroethane (HFC-161), and to the use of the refrigerant in a heat exchange system, including air conditioning, refrigeration applications and heat pump applications and to the use of such compositions as a replacement of the refrigerant R-410A or R1234yf for heating and cooling applications.

    METHOD OF FORMING REFRIGERANT SYSTEMS
    10.
    发明公开
    METHOD OF FORMING REFRIGERANT SYSTEMS 审中-公开

    公开(公告)号：US20230258379A1

    公开(公告)日：2023-08-17

    申请号：US18108315

    申请日：2023-02-10

    申请人： HONEYWELL INTERNATIONAL INC.

    发明人： Wissam Rached ,  Pawel Wisnik ,  Nitin Karwa ,  Nilesh Purohit ,  Kaimi Gao ,  Ankit Sethi

    IPC分类号： F25B45/00 ,  F25B5/02

    CPC分类号： F25B45/00 ,  F25B5/02

    摘要： Methods for forming an improved, centralized refrigeration systems comprising: (a) providing an existing refrigeration circuit with an existing high GWP refrigerant; (b) disconnecting the fluid connection between the existing liquid refrigerant from the condenser and the evaporators; (c) disconnecting the fluid connection between the existing refrigerant vapor from the evaporators and the compressor suction; (d) establishing a new first refrigeration circuit comprising the compressor and the condenser; (e) establishing a new second refrigeration circuit comprising the evaporators by removing existing refrigerant from the evaporators and the disconnected conduits and replacing the removed refrigerant with a second refrigerant comprising at least 50% of R1234ze(E) and being Class A1 and having an OEL greater than 400 and a GWP of about 150 or less; and thermally interconnecting the new first refrigeration circuit and the new second refrigeration circuit with an inter-circuit heat exchanger.