公开(公告)号：US11701457B2

公开(公告)日：2023-07-18

申请号：US16765323

申请日：2017-12-04

申请人： HONEYWELL INTERNATIONAL INC.

发明人： Senthilkumar Mk ,  George Whyte ,  John Stopforth ,  Claudia Acosta ,  Marco Barron ,  Anton Jeysing

IPC分类号： A61M1/16 ,  A61M1/28

CPC分类号： A61M1/1664 ,  A61M1/28 ,  A61M2205/0233 ,  A61M2205/3368 ,  A61M2205/3538 ,  A61M2205/3633 ,  A61M2205/3673

摘要： Systems and methods include a heat transfer body with opposing major surfaces formed from a thermally conductive substrate in intimate thermal interaction with an alumina exterior surface that extends across the major surfaces of the body. In an illustrative example, the heat source may be a substantially planar, silicone-based heater source (P-SBHS). The heat transfer body may be configured to thermally interact, for example, heat from a heat source proximate a first of the major surfaces to a second of the major surfaces. A temperature sensor module may be located, for example, proximate to the first major surface such that a temperature sensor thermally interacts with the first major surface. The temperature sensor module may, for example, insulate the temperature sensor from the P-SBHS.