公开(公告)号：US12219727B2

公开(公告)日：2025-02-04

申请号：US18025470

申请日：2022-08-18

Applicant: HONOR DEVICE CO., LTD.

Inventor： Jianqiang Guo ,  Wenjun Luo ,  Fan Yang

IPC: H05K7/00 ,  H05K7/14

Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The support bodies are provided between the frame plate and the circuit boards. The support bodies each include a first support portion and a second support portion. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.