公开(公告)号：US11138403B2

公开(公告)日：2021-10-05

申请号：US16304804

申请日：2016-05-27

Applicant: HONOR DEVICE CO., LTD.

Inventor： Kuibing Zhao ,  Wenping Guo ,  Dong Ma

IPC: G06K9/00 ,  H04M1/02

Abstract: A fingerprint module includes a fingerprint component, a button component, a support, and a resilient fixing element. The button component is fastened to a lower surface of the fingerprint component. The resilient fixing element is disposed on the lower surface of the fingerprint component and is located between the fingerprint component and the support. The resilient fixing element surrounds the button component, and the resilient fixing element resiliently connects the fingerprint component and the support. There is a gap between the button component and the support. When the fingerprint component is pressed, the resilient fixing element deforms, the gap becomes smaller, and the button component comes in contact with the support.