公开(公告)号：US20230164256A1

公开(公告)日：2023-05-25

申请号：US17773302

申请日：2021-08-30

Applicant: HONOR DEVICE CO., LTD.

Inventor： Yang LIU ,  Lei FENG ,  Wei ZHANG ,  Wenxing YAO

IPC: H04M1/02

CPC classification number: H04M1/0283 ,  H04M1/0264

Abstract: A cover body structure, a back cover, and an electronic device are provided, related to the field of electronic device technologies. The cover body structure includes a glass cover plate, a first ink layer, a first glue layer, and a plastic edge portion. The first ink layer is disposed at least on an edge of the glass cover plate. The first glue layer is disposed on the first ink layer on the edge of the glass cover plate. The plastic edge portion is disposed on the first glue layer on the edge of the glass cover plate. The first glue layer is a glue layer viscous at least at an injection molding temperature of the plastic edge portion, and the first ink layer is an ink layer that is able to withstand the injection molding temperature of the plastic edge portion.