公开(公告)号：US20250081421A1

公开(公告)日：2025-03-06

申请号：US18728659

申请日：2023-06-14

Applicant: HONOR DEVICE CO., LTD.

Inventor： Ye LV ,  Yin MENG

IPC: H05K9/00

Abstract: This application provides a circuit board assembly and an electronic device. The circuit board assembly includes a circuit board, a chip, a shielding cover, and a conductive structure. The circuit board includes a first surface and a second surface that are disposed opposite to each other. The chip is disposed on the first surface. The shielding cover defines accommodation space, a recess is provided on a surface of the shielding cover facing the first surface, and the recess runs through the shielding cover and is communicated with the accommodation space. The conductive structure is located in the recess and connected between a top wall of the recess and the first surface, and orthographic projection of the conductive structure on the circuit board at least partially falls within an orthographic projection range of the chip on the circuit board.