公开(公告)号：US20250071936A1

公开(公告)日：2025-02-27

申请号：US18454755

申请日：2023-08-23

Applicant: HRL LABORATORIES, LLC

Inventor： John H. Martin ,  David A. Smith ,  Christopher Roper

IPC: H05K7/20

Abstract: A microchannel cooling block includes: a base plate; a microchannel array including a plurality of thermally conductive plates connected to and extending from a surface of the base plate, the thermally conductive plates being aligned so that a highest or second highest thermally conductive axis thereof extends away from the surface of the base plate, adjacent ones of the thermally conductive plates being spaced apart from each other to form a plurality of microchannels between the thermally conductive plates, one of the microchannels being between each adjacent two of the thermally conductive plates; and a manifold connected to the thermally conductive plates, an interior of the manifold being in fluid communication with the microchannels in the microchannel array.