公开(公告)号：US20240014843A1

公开(公告)日：2024-01-11

申请号：US18471735

申请日：2023-09-21

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Bowen DING ,  Keji CUI ,  Wanyi GUO

IPC: H04B1/403 ,  H04B1/00

CPC classification number: H04B1/403 ,  H04B1/0028

Abstract: The present disclosure relates to multi-chip apparatuses and electronic devices. One example multi-chip apparatus includes a first chip with a first internal signal generator and a first frequency multiplier, and a second chip with a second internal signal generator and a second frequency multiplier. The second frequency multiplier includes a first receiving circuit, a second receiving circuit, and a load circuit, where an input end of the first receiving circuit is coupled to an output end of the first internal signal generator, an input end of the second receiving circuit is coupled to an output end of the second internal signal generator, and an output end of the first receiving circuit and an output end of the second receiving circuit are coupled to an input end of the load circuit.