公开(公告)号：US20200275553A1

公开(公告)日：2020-08-27

申请号：US16491978

申请日：2017-06-05

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yong WANG ,  Jitao QIAO ,  Rui SUN ,  Fujian ZHU ,  Haixing DING

IPC: H05K1/14 ,  H05K1/02

Abstract: The mainboard includes at least two layers of PCBs and electronic components disposed on each layer of PCB of the at least two layers of PCBs, where each layer of PCB constitutes a unit module. The at least two layers of PCBs are stacked, and the at least two layers of PCBs are electrically connected. Any two adjacent unit modules are connected by using a frame board, and the frame board has a middle-hollow or partially hollow structure. The mainboard is designed into a multilayer composite stacked structure, to reduce an area occupied by the mainboard in horizontal directions and provide plane space for electronic parts such as a display module, a camera module, a speaker box component.