公开(公告)号：US20240011130A1

公开(公告)日：2024-01-11

申请号：US18471511

申请日：2023-09-21

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Li FAN ,  Hua WANG ,  Banghong HU ,  Li PANG ,  Han YAN ,  Xiaojun YANG

IPC: C22C21/02 ,  C22C1/02 ,  C22C1/03 ,  B22D17/00 ,  C22F1/043 ,  H05K5/04

CPC classification number: C22C21/02 ,  C22C1/026 ,  C22C1/03 ,  B22D17/00 ,  C22F1/043 ,  H05K5/04

Abstract: This application provides an aluminum alloy, an electronic device, and an aluminum alloy preparation method. The aluminum alloy, based on mass percentage, includes the following components: silicon: 8.0%-10.0%, magnesium: 0.001%-0.2%, manganese: 0.001%-0.09%, iron: 0.7%-1.3%, and strontium: 0.001%-0.05%, with a balance of aluminum and inevitable impurities, where the inevitable impurities account for ≤0.15%. The aluminum alloy has characteristics of a high heat conductivity, good molding performance, favorable corrosion resistance, and favorable mechanical properties without heat treatment.