公开(公告)号：US20250112702A1

公开(公告)日：2025-04-03

申请号：US18978449

申请日：2024-12-12

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Wei LIU ,  Liuyong CHEN ,  Changzheng SU ,  Fei YU

IPC: H04B10/40

Abstract: Embodiments of the present invention disclose an optical module, a related apparatus, and an assembly method. in one example, an optical module includes a first circuit board, a second circuit board, and a connection board. The first circuit board includes a transmitter optical subassembly and a receiver optical subassembly. The second circuit board includes a processing unit. The first circuit board further includes a first connection port. The second circuit board further includes a second connection port. The transmitter optical subassembly and the receiver optical subassembly are separately connected to the first connection port. The processing unit is connected to the second connection port.