公开(公告)号：US20250022805A1

公开(公告)日：2025-01-16

申请号：US18898767

申请日：2024-09-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Shun ZHANG ,  Wenyi WANG ,  Chong CHEN ,  Ning ZHAI

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/16

Abstract: The technology of this application relates to an optical-electrical co-package structure including a carrier circuit board, an optical-electrical conversion module, a package circuit board, and an electrical chip. The package circuit board and the optical-electrical conversion module are respectively located on a first side surface and a second side surface that are opposite to each other of the carrier circuit board. The electrical chip is disposed on the package circuit board, and the optical-electrical conversion module is separated from the package circuit board, to significantly reduce a size of the package circuit board, reduce processing difficulty and costs of the package circuit board, and reduce a loss of a high-speed signal transmission link. In addition, the carrier circuit board is provided with a first conductive via, and the package circuit board is electrically connected to the optical-electrical conversion module to reduce inter-board traces on a connection link between the optical-electrical conversion module and the package circuit board.