公开(公告)号：US20230299543A1

公开(公告)日：2023-09-21

申请号：US18323621

申请日：2023-05-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Congtu XIAO ,  Tao YE ,  Tinghe WU ,  Zhengyan OU

IPC: H01R13/6587 ,  H01R13/652 ,  H01R13/627

CPC classification number: H01R13/6587 ,  H01R13/652 ,  H01R13/627

Abstract: This application provides a lead module. The lead module includes a plurality of lead pairs and two shielding pieces, and the two shielding pieces each are made of a conductive material and are located parallel to each other on two sides of the plurality of lead pairs. Therefore, a ground wire or a shielding element may no longer be disposed between the two shielding pieces in the lead module of this application and between parts that are of adjacent lead pairs and that correspond to a body part of a lead, and the lead module uses the two shielding pieces as the ground wire and the shielding element. Therefore, crosstalk between the lead pairs for signal transmission is effectively reduced with a simple structure. This application further provides an electrical connector including the lead module and a connector component including the electrical connector.