公开(公告)号：US20240353535A1

公开(公告)日：2024-10-24

申请号：US18759336

申请日：2024-06-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Tianyu LI ,  Shuai WANG ,  Zhonghua CAI ,  Anliang YU ,  Wei WANG

IPC: G01S7/481 ,  G01S17/89

CPC classification number: G01S7/4816 ,  G01S7/4817 ,  G01S17/89

Abstract: The present disclosure relates to control methods, lidars, and terminal devices. In an example method, a control apparatus controls a receiving optical system to receive a first echo signal reflected by a target object, and controls a detector to convert the first echo signal into an electrical signal by using a first pixel configuration, where in the first pixel configuration, different regions of the detector have different pixel configurations, or the detector has different pixel configurations in different time periods.

公开(公告)号：US20240298408A1

公开(公告)日：2024-09-05

申请号：US18660945

申请日：2024-05-10

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jun LIU ,  Zuomin LU ,  Tianyu LI

IPC: H05K1/18 ,  G01S7/481 ,  G03B30/00 ,  H04N23/54

CPC classification number: H05K1/18 ,  H04N23/54 ,  G01S7/4816 ,  G03B30/00 ,  H05K2201/10151 ,  H05K2201/10424

Abstract: The present disclosure relates to circuit board reinforcing structures, photosensitive apparatuses, and terminals. The photosensitive apparatus is used in assisted driving, intelligent driving, or autonomous driving. In one example circuit board reinforcing structure, a reinforcing plate of which deformation varies little with temperature is used to suppress warping and deformation of a circuit board caused by a temperature change, so that an impact of the warping and deformation of the circuit board on a location of a photosensitive chip is greatly reduced. In addition, the reinforcing plate and the photosensitive chip are disposed on a same side of the circuit board.