公开(公告)号：US20210075940A1

公开(公告)日：2021-03-11

申请号：US16952984

申请日：2020-11-19

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xi CAO ,  Kun RAN ,  Xiangyong QING

IPC: H04N5/225 ,  G02B5/20 ,  G02B7/00 ,  G03B11/00

Abstract: This application provides example camera assemblies and example assembly methods. One example method includes plastic-packaging a surface mount electronic component and an image sensor to form a target plastic-packaged module, where the target plastic-packaged module includes an active surface, and where a solder end of the surface mount electronic component and a solder end of the image sensor are exposed on the active surface. A redistribution layer (RDL) can then be prepared and the RDL can then be drilled to form a through-hole, where the through-hole is opposite to a photosensitive area of the image sensor, where the RDL includes a dielectric layer and metal wiring disposed at the dielectric layer. The metal wiring exposed on the first surface of the RDL can then be connected to a solder end on the active surface of the target plastic-packaged module.