公开(公告)号：US20210084753A1

公开(公告)日：2021-03-18

申请号：US17104388

申请日：2020-11-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yiyao WU ,  Xinbo MA ,  Zhiqiang LIAO

IPC: H05K1/02 ,  H01R12/53

Abstract: One example printed circuit board transmission line includes a substrate layer, a metal line, at least one first welding point, at least one first transmission medium, and a metal component that is configured to implement a grounding function. The metal line is plated on a surface of the substrate layer. The at least one first welding point is a welding point at which the metal line is connected to the at least one first transmission medium. The at least one first welding point is welded to the metal line and welded to the at least one first transmission medium. The metal component is welded to the at least one first transmission medium. At least one groove is provided on one side of the at least one first welding point.