公开(公告)号：US11849559B2

公开(公告)日：2023-12-19

申请号：US17732665

申请日：2022-04-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xuguang Yang ,  Zhiwen Yang ,  Shaohua Zhang ,  Zelong Jiao

IPC: H05K7/14

CPC classification number: H05K7/1489 ,  H05K7/1491

Abstract: An interconnection structure used in an electronic device includes a chassis, a first line board, a second line board, and a heat dissipation component. The heat dissipation component is disposed on a first side surface of the chassis, the first side surface includes a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface includes a second opening. The second line board is horizontally disposed inside the chassis, and the first line board is vertically inserted onto the side surface of the second line board, to reduce a quantity of parts on a system air duct, reduce a flow resistance of a system, and improve a heat dissipation capability of the system.