公开(公告)号：US20250014976A1

公开(公告)日：2025-01-09

申请号：US18889286

申请日：2024-09-18

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yilu Liu ,  Xiaojun Wang ,  Guangwei Wang ,  Xiaodong Cong ,  Taotao Zhang

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/34 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A chip system includes a BGA chip, a PCB, a signal source module, and a detection module. A function pin of the BGA chip is soldered to a function solder pad of the PCB by a first solder ball and a detection pin of the BGA chip is soldered to a detection solder pad of the PCB by a second solder ball. A designed life of the second solder ball is shorter than a designed life of the first solder ball. A detection path is formed between the BGA chip and the PCB and includes the second solder ball. The signal source module is configured to send a detection signal to the detection module through the detection path to determine a status of the detection path based on the received detection signal.