公开(公告)号：US11647608B2

公开(公告)日：2023-05-09

申请号：US17486593

申请日：2021-09-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yiying Jian ,  Dingfang Li ,  Xinhu Gong ,  Gaoliang Xia

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20

CPC classification number: H05K7/20418 ,  H05K7/20718

Abstract: The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.