公开(公告)号：US20240324093A1

公开(公告)日：2024-09-26

申请号：US18679711

申请日：2024-05-31

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Baoshan ZHUANG ,  Zhenxing XIONG ,  Caijun ZHAO ,  Jianbo XIONG

IPC: H05K1/02 ,  H05K1/14 ,  H05K9/00

CPC classification number: H05K1/0203 ,  H05K1/14 ,  H05K9/0024

Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. In the circuit board assembly, at least one first shielding component is disposed on a periphery of a chip component, each first shielding component includes a shielding frame and a shielding cover, an end that is of the shielding frame and that is away from the shielding cover is fastened to a first circuit board, at least a part of the shielding cover is located between the chip component and a heat sink, and the shielding cover is movably connected to the shielding frame, so that the shielding cover can move in a vertical direction relative to the shielding frame. In this way, the first shielding component can adapt to chip components of different heights and different assembly gaps.