公开(公告)号：US20230335932A1

公开(公告)日：2023-10-19

申请号：US18336059

申请日：2023-06-16

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zhiyong Peng ,  Jiayong Chen ,  Baoliang Sun ,  Wen Yu ,  Yinzhong Tang

IPC: H01R12/72 ,  H01R13/533 ,  H01R12/67

CPC classification number: H01R12/724 ,  H01R12/67 ,  H01R13/533

Abstract: An array type connection structure is disclosed. The structure includes a support and connecting assemblies. There is no signal cable routing in the support. Each connecting assembly penetrates through the support; a first side of each connecting assembly has a connector interface including a plurality of first signal terminals, and the connector interface is configured to be connected to a first electronic component located on a first side of the support. A second side of each connecting assembly is directly connected to a plurality of cables, the plurality of cables are in a one-to-one correspondence with the plurality of second signal terminals of the connecting assembly, and the cable is configured to be connected to a second electronic component located on a second side of the support. The support is provided with a heat dissipation through hole, which is at least partially located between two adjacent connecting assemblies.