METHOD OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR DEVICES
    1.
    发明申请
    METHOD OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR DEVICES 有权
    制造非易失性半导体器件的方法

    公开(公告)号:US20100112768A1

    公开(公告)日:2010-05-06

    申请号:US12611362

    申请日:2009-11-03

    IPC分类号: H01L21/336

    CPC分类号: H01L27/11573

    摘要: A non-volatile semiconductor device includes a memory cell in a first area of a substrate, a low voltage transistor in a second area of the substrate, and a high voltage transistor in a third area of the substrate. The memory cell includes a tunnel insulation layer formed on the substrate, a charge trapping layer pattern formed on the tunnel insulation layer in the first area of the substrate, a blocking layer pattern formed on the charge trapping layer pattern and a control gate formed on the blocking layer pattern. The control gate has a width substantially smaller than a width of the blocking layer pattern and the width of the control gate is substantially smaller than a width of the charge trapping layer pattern. In addition, an offset is formed between the control gate and the blocking layer pattern such that a spacer is not formed on a sidewall of the control gate.

    摘要翻译: 非易失性半导体器件包括在衬底的第一区域中的存储单元,在衬底的第二区域中的低电压晶体管,以及在衬底的第三区域中的高压晶体管。 存储单元包括形成在基板上的隧道绝缘层,形成在基板的第一区域中的隧道绝缘层上的电荷俘获层图案,形成在电荷俘获层图案上的阻挡层图案和形成在基板上的控制栅极 阻挡层图案。 控制栅极的宽度显着小于阻挡层图案的宽度,并且控制栅极的宽度基本上小于电荷俘获层图案的宽度。 此外,在控制栅极和阻挡层图案之间形成偏移,使得在控制栅极的侧壁上未形成间隔物。

    NON-VOLATILE SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR DEVICES
    2.
    发明申请
    NON-VOLATILE SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR DEVICES 有权
    非挥发性半导体器件及制造非易失性半导体器件的方法

    公开(公告)号:US20110233653A1

    公开(公告)日:2011-09-29

    申请号:US13157753

    申请日:2011-06-10

    IPC分类号: H01L29/792

    CPC分类号: H01L27/11573

    摘要: A non-volatile semiconductor device includes a memory cell in a first area of a substrate, a low voltage transistor in a second area of the substrate, and a high voltage transistor in a third area of the substrate. The memory cell includes a tunnel insulation layer formed on the substrate, a charge trapping layer pattern formed on the tunnel insulation layer in the first area of the substrate, a blocking layer pattern formed on the charge trapping layer pattern and a control gate formed on the blocking layer pattern. The control gate has a width substantially smaller than a width of the blocking layer pattern and the width of the control gate is substantially smaller than a width of the charge trapping layer pattern. In addition, an offset is formed between the control gate and the blocking layer pattern such that a spacer is not formed on a sidewall of the control gate.

    摘要翻译: 非易失性半导体器件包括在衬底的第一区域中的存储单元,在衬底的第二区域中的低电压晶体管,以及在衬底的第三区域中的高压晶体管。 存储单元包括形成在基板上的隧道绝缘层,形成在基板的第一区域中的隧道绝缘层上的电荷俘获层图案,形成在电荷俘获层图案上的阻挡层图案和形成在基板上的控制栅极 阻挡层图案。 控制栅极的宽度显着小于阻挡层图案的宽度,并且控制栅极的宽度基本上小于电荷俘获层图案的宽度。 此外,在控制栅极和阻挡层图案之间形成偏移,使得在控制栅极的侧壁上未形成间隔物。