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1.发明授权公开(公告)号：US11477924B2
公开(公告)日：2022-10-18
申请号：US17196932
申请日：2021-03-09
Applicant: Hamilton Sundstrand Corporation
Inventor： Constantinos J. Mantis , Edward John Marotta , James A. Gosse
Abstract: An interface for mitigating electromagnetic interference (EMI) on a printed circuit board (PCB) is disclosed. The PCB can contain circuit components and includes one or more signal planes sandwiched between corresponding ground planes. The PCB has a first and second side and an interface region separating the first and second sides that includes a partition wall projecting outward from the interface region, configured for EMI shielding between the first side and second sides, one or more pairs of input and output pads straddling the interface region on respective first and second sides and configured to accommodate an EMI line filter, and a ground barrier within the printed circuit board under the interface region. A method of mitigating EMI using the interface is also disclosed.
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2.发明申请公开(公告)号：US20210307219A1
公开(公告)日：2021-09-30
申请号：US17196932
申请日：2021-03-09
Applicant: Hamilton Sundstrand Corporation
Inventor： Constantinos J. Mantis , Edward John Marotta , James A. Gosse
Abstract: An interface for mitigating electromagnetic interference (EMI) on a printed circuit board (PCB) is disclosed. The PCB can contain circuit components and includes one or more signal planes sandwiched between corresponding ground planes. The PCB has a first and second side and an interface region separating the first and second sides that includes a partition wall projecting outward from the interface region, configured for EMI shielding between the first side and second sides, one or more pairs of input and output pads straddling the interface region on respective first and second sides and configured to accommodate an EMI line filter, and a ground barrier within the printed circuit board under the interface region. A method of mitigating EMI using the interface is also disclosed.
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