OSCILLATING HEAT PIPE INTEGRATED THERMAL MANAGEMENT SYSTEM FOR POWER ELECTRONICS

    公开(公告)号:US20210136954A1

    公开(公告)日:2021-05-06

    申请号:US16670043

    申请日:2019-10-31

    Abstract: Disclosed is a thermal management system for removing heat from a power electronic heat source, the system comprising: a base plate having a plurality of fluid passages there through and extending between and inlet side of the base plate and an outlet side of the base plate; and a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another, the plurality of heat transfer pipe segments containing a two-phase working fluid, and the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid.

    COMPLIANT OSCILLATING HEAT PIPES
    2.
    发明申请

    公开(公告)号:US20210254899A1

    公开(公告)日:2021-08-19

    申请号:US16791471

    申请日:2020-02-14

    Abstract: An oscillating heat pipe device can include a body formed to be at least partially flexible, one or more channels within the body and defined by the body, an evaporator portion within the body at a first end of the one or more channels and in fluid communication with the one or more channels, and a condenser portion within the body at a second end of the one or more channels and in fluid communication with the one or more channels. The body can be configured to flex between the evaporator portion and the condenser portion. The device can include a heat transfer fluid trapped within the channels to transfer heat between the evaporator portion and the condenser portion.

    Method of fabricating an oscillating heat pipe

    公开(公告)号:US11045912B2

    公开(公告)日:2021-06-29

    申请号:US16444600

    申请日:2019-06-18

    Abstract: A method of fabricating an oscillating heat pipe includes building the oscillating heat pipe with a layer-by-layer additive manufacturing process such that the oscillating heat pipe includes a body of solid material, an array of channels, an evaporator portion, and a condenser portion. The array of channels are disposed in the body and define a continuous loop through which a fluid flows. The array of channels is formed by cavities in the body as the body is formed with layer-by-layer additive manufacturing. An inner surface of a channel includes a flow directing feature that is configured to promote a first direction of flow and that is configured to provide resistance against a second direction of flow that is opposite the first direction of flow.

    Oscillating heat pipe integrated thermal management system for power electronics

    公开(公告)号:US11051428B2

    公开(公告)日:2021-06-29

    申请号:US16670043

    申请日:2019-10-31

    Abstract: Disclosed is a thermal management system for removing heat from a power electronic heat source, the system comprising: a base plate having a plurality of fluid passages there through and extending between and inlet side of the base plate and an outlet side of the base plate; and a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another, the plurality of heat transfer pipe segments containing a two-phase working fluid, and the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid.

    METHOD OF FABRICATING AN OSCILLATING HEAT PIPE

    公开(公告)号:US20210213571A1

    公开(公告)日:2021-07-15

    申请号:US17215998

    申请日:2021-03-29

    Abstract: A method of fabricating an oscillating heat pipe includes building the oscillating heat pipe with a layer-by-layer additive manufacturing process such that the oscillating heat pipe includes a body of solid material, an array of channels, an evaporator portion, and a condenser portion. The array of channels are disposed in the body and define a continuous loop through which a fluid flows. The array of channels is formed by cavities in the body as the body is formed with layer-by-layer additive manufacturing. An inner surface of a channel includes a flow directing feature that is configured to promote a first direction of flow and that is configured to provide resistance against a second direction of flow that is opposite the first direction of flow.

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