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公开(公告)号:US20210136954A1
公开(公告)日:2021-05-06
申请号:US16670043
申请日:2019-10-31
Applicant: Hamilton Sundstrand Corporation
Inventor: Jinliang Wang , Suman Dwari
IPC: H05K7/20 , F28F13/10 , H01L25/07 , H01L23/427
Abstract: Disclosed is a thermal management system for removing heat from a power electronic heat source, the system comprising: a base plate having a plurality of fluid passages there through and extending between and inlet side of the base plate and an outlet side of the base plate; and a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another, the plurality of heat transfer pipe segments containing a two-phase working fluid, and the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid.
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公开(公告)号:US20210254899A1
公开(公告)日:2021-08-19
申请号:US16791471
申请日:2020-02-14
Applicant: Hamilton Sundstrand Corporation
Inventor: Abbas A. Alahyari , Jinliang Wang , Ram Ranjan
IPC: F28D15/02
Abstract: An oscillating heat pipe device can include a body formed to be at least partially flexible, one or more channels within the body and defined by the body, an evaporator portion within the body at a first end of the one or more channels and in fluid communication with the one or more channels, and a condenser portion within the body at a second end of the one or more channels and in fluid communication with the one or more channels. The body can be configured to flex between the evaporator portion and the condenser portion. The device can include a heat transfer fluid trapped within the channels to transfer heat between the evaporator portion and the condenser portion.
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公开(公告)号:US11045912B2
公开(公告)日:2021-06-29
申请号:US16444600
申请日:2019-06-18
Applicant: Hamilton Sundstrand Corporation
Inventor: Abbas A. Alahyari , Ram Ranjan , Jinliang Wang
Abstract: A method of fabricating an oscillating heat pipe includes building the oscillating heat pipe with a layer-by-layer additive manufacturing process such that the oscillating heat pipe includes a body of solid material, an array of channels, an evaporator portion, and a condenser portion. The array of channels are disposed in the body and define a continuous loop through which a fluid flows. The array of channels is formed by cavities in the body as the body is formed with layer-by-layer additive manufacturing. An inner surface of a channel includes a flow directing feature that is configured to promote a first direction of flow and that is configured to provide resistance against a second direction of flow that is opposite the first direction of flow.
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公开(公告)号:US11051428B2
公开(公告)日:2021-06-29
申请号:US16670043
申请日:2019-10-31
Applicant: Hamilton Sundstrand Corporation
Inventor: Jinliang Wang , Suman Dwari
IPC: H05K7/20 , F28F13/10 , H01L23/427 , H01L25/07
Abstract: Disclosed is a thermal management system for removing heat from a power electronic heat source, the system comprising: a base plate having a plurality of fluid passages there through and extending between and inlet side of the base plate and an outlet side of the base plate; and a plurality of heat transfer pipe segments respectively attached to one or more of the plurality of fluid passages at the inlet side of the base plate and the outlet side of the base plate, the plurality of heat transfer pipe segments arranged adjacent one another, the plurality of heat transfer pipe segments containing a two-phase working fluid, and the plurality of heat transfer pipe segments forming a continuous flow path through and back into the base plate for the two-phase working fluid.
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公开(公告)号:US20210213571A1
公开(公告)日:2021-07-15
申请号:US17215998
申请日:2021-03-29
Applicant: Hamilton Sundstrand Corporation
Inventor: Abbas A. Alahyari , Ram Ranjan , Jinliang Wang
Abstract: A method of fabricating an oscillating heat pipe includes building the oscillating heat pipe with a layer-by-layer additive manufacturing process such that the oscillating heat pipe includes a body of solid material, an array of channels, an evaporator portion, and a condenser portion. The array of channels are disposed in the body and define a continuous loop through which a fluid flows. The array of channels is formed by cavities in the body as the body is formed with layer-by-layer additive manufacturing. An inner surface of a channel includes a flow directing feature that is configured to promote a first direction of flow and that is configured to provide resistance against a second direction of flow that is opposite the first direction of flow.
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