公开(公告)号：US09638471B2

公开(公告)日：2017-05-02

申请号：US14537311

申请日：2014-11-10

Applicant: Hamilton Sundstrand Corporation

Inventor： Mark C. Neumann ,  Leo J. Veilleux, Jr.

IPC: F28F3/00 ,  F28D9/00 ,  B23P15/26

CPC classification number: F28D9/0093 ,  B23P15/26 ,  F28D15/00 ,  F28D2021/0021 ,  F28D2021/0049

Abstract: A heat exchanger is provided having a first fluid circuit defining a first volume and configured to permit a first fluid to flow therethrough with a first fluid supply. The heat exchanger includes a second fluid circuit defining a second volume separate from the first volume and sharing at least one common wall with the first enclosed volume, and configured to permit a second fluid to flow therethrough from a second fluid supply. One or more thermal transfer sheets having one or more channels therein are configured in structural and thermal contact with both the first and second fluid circuits, the channels having a thermodynamic fluid disposed therein and configured to transfer heat between the first fluid circuit and the second fluid circuit. A thermal transfer rate through the at least one common wall is less than a thermal transfer rate of the one or more thermal transfer sheets.

公开(公告)号：US20160131432A1

公开(公告)日：2016-05-12

申请号：US14537311

申请日：2014-11-10

Applicant: Hamilton Sundstrand Corporation

Inventor： Mark C. Neumann ,  Leo J. Veilleux, JR.

IPC: F28D9/00 ,  B23P15/26

CPC classification number: F28D9/0093 ,  B23P15/26 ,  F28D15/00 ,  F28D2021/0021 ,  F28D2021/0049

Abstract: A heat exchanger is provided having a first fluid circuit defining a first volume and configured to permit a first fluid to flow therethrough with a first fluid supply. The heat exchanger includes a second fluid circuit defining a second volume separate from the first volume and sharing at least one common wall with the first enclosed volume, and configured to permit a second fluid to flow therethrough from a second fluid supply. One or more thermal transfer sheets having one or more channels therein are configured in structural and thermal contact with both the first and second fluid circuits, the channels having a thermodynamic fluid disposed therein and configured to transfer heat between the first fluid circuit and the second fluid circuit. A thermal transfer rate through the at least one common wall is less than a thermal transfer rate of the one or more thermal transfer sheets.

Abstract translation: 提供了一种热交换器，其具有限定第一容积的第一流体回路并且构造成允许第一流体通过第一流体供应流过其中。 热交换器包括第二流体回路，其限定与第一容积分离的第二容积并与第一封闭容积共享至少一个公共壁，并且构造成允许第二流体从第二流体供应流过。 其中具有一个或多个通道的一个或多个热转印片被构造成与第一和第二流体回路结构和热接触，通道具有设置在其中的热力学流体并且构造成在第一流体回路和第二流体之间传递热量 电路。 通过至少一个公共壁的热传递速率小于一个或多个热转印片材的热转印速率。