公开(公告)号：US11825633B2

公开(公告)日：2023-11-21

申请号：US17674035

申请日：2022-02-17

申请人： Hamilton Sundstrand Corporation (HSC)

发明人： Alexander Trotman ,  Josh Kamp ,  Judy Schwartz ,  Robert DeFelice ,  Michael Doe, Jr. ,  Anthony Matthew DeLugan

IPC分类号： H05K7/20 ,  H05K7/14

CPC分类号： H05K7/205 ,  H05K7/1404 ,  H05K7/20545

摘要： An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.