公开(公告)号：US20120090652A1

公开(公告)日：2012-04-19

申请号：US13113495

申请日：2011-05-23

申请人： Hao-Chun HSIEH ,  Hsin-Lun Tasi ,  Chia-Hsien Lee

发明人： Hao-Chun HSIEH ,  Hsin-Lun Tasi ,  Chia-Hsien Lee

IPC分类号： B08B5/02

CPC分类号： B08B5/02

摘要： The cleaning apparatus for solder paste in apertures according to the present invention comprises a stencil, a guiding plate, and a blower. The stencil has a plurality of apertures with residual solder paste on the sidewalls thereof. The guiding plate is disposed above the stencil and has a plurality of wind-guiding pillars and a plurality of wind-guiding holes. The locations of the wind-guiding pillars are opposite to the locations of the apertures; the wind-guiding holes are located around the wind-guiding pillars. The blower is disposed above the guiding plate and provides a gas to the guiding plate. The gas is guided into the apertures by means of the wind-guiding pillars and the wind-guiding holes and pushes completely the solder paste therein out. Thereby, accumulation of solder paste in the sidewalls of the apertures can be avoided. Consequently, deterioration of adhesion of electronic components caused by fewer amount of solder paste printed on the carrier can be prevented.

摘要翻译： 根据本发明的孔中的焊膏清洁装置包括模板，引导板和鼓风机。 模板在其侧壁上具有多个具有残留焊膏的孔。 引导板设置在模板上方，并具有多个引导支柱和多个导风孔。 导风柱的位置与孔的位置相反; 导风孔位于导风柱周围。 鼓风机设置在引导板上方，并向引导板提供气体。 气体通过导风柱和导风孔被引导到孔中，并将其中的焊膏完全推出。 因此，可以避免焊膏在孔的侧壁中的积聚。 因此，可以防止由较少量印刷在载体上的焊膏引起的电子部件的附着力劣化。