Tile cutter
    1.
    发明授权

    公开(公告)号:US12011843B1

    公开(公告)日:2024-06-18

    申请号:US17393339

    申请日:2021-08-03

    摘要: Vinyl tile cutting devices are described herein. The described tile cutting devices include a base element. The base element is configured to support a tile thereon. The described tile cutting devices further include a cutting assembly. The cutting assembly includes a rotatable cutting blade for cutting said tile along an arc. In some embodiments, the cutting assembly includes an adjustment mechanism for changing the radius of the arc. The vinyl tile cutting device further includes a heating element. The heating element is configured to heat said tile prior to the cutting of said tile.

    Tile cutting device
    2.
    发明授权

    公开(公告)号:US11077576B1

    公开(公告)日:2021-08-03

    申请号:US16141958

    申请日:2018-09-25

    摘要: Vinyl tile cutting devices are disclosed herein. The disclosed vinyl tile cutting devices include a base element. The base element is configured to support a vinyl tile thereon. The disclosed vinyl tile cutting devices further include a cutting assembly. The cutting assembly includes one or more rotatable cutting blades for cutting said vinyl tile in a generally linear manner. In some embodiments, the vinyl tile cutting device includes a heating element. The heating element is configured to heat said tile prior to the cutting of said vinyl tile.