公开(公告)号：US20110204458A1

公开(公告)日：2011-08-25

申请号：US13099737

申请日：2011-05-03

申请人： Haruo FURUTA ,  Ryoji Matsuda ,  Shuichi Ueno ,  Takeharu Kuroiwa

发明人： Haruo FURUTA ,  Ryoji Matsuda ,  Shuichi Ueno ,  Takeharu Kuroiwa

IPC分类号： H01L29/82 ,  H01L43/12

CPC分类号： H01L43/08 ,  B82Y10/00 ,  H01L27/228 ,  H01L43/12

摘要： The semiconductor device which has a memory cell including the TMR film with which memory accuracy does not deteriorate, and its manufacturing method are obtained. A TMR element (a TMR film, a TMR upper electrode) is selectively formed in the region which corresponds in plan view on a TMR lower electrode in a part of formation area of a digit line. A TMR upper electrode is formed by 30-100 nm thickness of Ta, and functions also as a hard mask at the time of a manufacturing process. The interlayer insulation film formed from LT-SiN on the whole surface of a TMR element and the upper surface of a TMR lower electrode is formed, and the interlayer insulation film which covers the whole surface comprising the side surface of a TMR lower electrode, and includes LT-SiN is formed. The interlayer insulation film which covers the whole surface and includes SiO2 is formed.

摘要翻译： 具有包含记忆精度不劣化的TMR膜的存储单元的半导体装置及其制造方法。 在数字线的形成区域的一部分的TMR下电极的平面图中对应的区域选择性地形成TMR元件（TMR膜，TMR上电极）。 TMR上电极由Ta的30-100nm厚度形成，并且在制造过程中也用作硬掩模。 在TMR元件的整个表面和TMR下电极的整个表面上形成由LT-SiN形成的层间绝缘膜，覆盖包括TMR下电极的侧表面的整个表面的层间绝缘膜和 包括LT-SiN。 形成覆盖整个表面并包含SiO 2的层间绝缘膜。