摘要:
A method and apparatus for automated testing of a plurality of electrostatic discharge (ESD) devices on a wafer. The wafer has M padsets and N conductive pads on each padset, where m is at least 1, and n is at least 2, and each ESD device is conductively coupled to a unique plurality of pads of a padset of the M padsets. Testing sequences, under program control of a computer system, implement the testing of the ESD devices.