TRANSDERMAL PATCH FORMULATION
    2.
    发明申请
    TRANSDERMAL PATCH FORMULATION 审中-公开
    透皮配对配方

    公开(公告)号:US20140170208A1

    公开(公告)日:2014-06-19

    申请号:US14186520

    申请日:2014-02-21

    IPC分类号: A61K9/70 A61K31/135

    摘要: A method for preparing a transdermal patch comprising a substrate layer is provided, the method comprising the steps of contacting an active pharmaceutical ingredient with a retaining means to provide a composition, applying the composition obtained in step (a) to a carrier material to form a substrate layer of the transdermal patch, wherein the retaining means remain within the final transdermal patch.

    摘要翻译: 提供了一种制备包含基底层的透皮贴剂的方法,所述方法包括以下步骤:使活性药物成分与保留装置接触以提供组合物,将步骤(a)中获得的组合物应用于载体材料以形成 透皮贴片的底层,其中保留装置保留在最终透皮贴剂内。