公开(公告)号：US20200049909A1

公开(公告)日：2020-02-13

申请号：US16526374

申请日：2017-01-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Sagi Mathai ,  Michael Rene Ty Tan ,  Marco Fiorentino ,  Paul Kessler Rosenberg ,  David Kielpinski ,  Wayne Victor Sorin

IPC: G02B6/42 ,  G02B6/34 ,  H01L23/544

Abstract: In some examples a silicon photonic (SiPh) solder reflowable assembly may comprise a silicon interposer bonded to an organic substrate, the silicon interposer having an optical grating disposed on the interposer to couple an optical signal, a lens array chip, the lens array comprising one or more lenses on a wafer, the lens array chip flip chip reflowed to the silicon interposer by a bonding agent and the one or more lenses having a predetermined shape that expands, collimates, and tilts a beam of the optical signal exiting the grating. The wafer has a coefficient of thermal expansion (CTE) that matches silicon and the one or more lenses and the grating are aligned in such a way the optical signal enters the grating at a desired angle.