公开(公告)号：US20180094875A1

公开(公告)日：2018-04-05

申请号：US15819463

申请日：2017-11-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael Sabotta ,  David A. Moore

IPC: F28F1/40 ,  H05K7/20 ,  H01L23/473

CPC classification number: F28F1/40 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20781 ,  H01L2924/00

Abstract: An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.