公开(公告)号：US20160366792A1

公开(公告)日：2016-12-15

申请号：US15120515

申请日：2014-05-28

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kelly K SMITH ,  Richard A BARGERHUFF ,  Rachel Nicole POLLOCK ,  Kapil Rao GANTA PAPA RAO BALA

IPC: H05K7/20 ,  G05D7/06

CPC classification number: H05K7/20781 ,  G05D7/0635 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20772 ,  H05K7/2079 ,  H05K7/20836

Abstract: Examples herein disclose a multiple tier cooling structure. The multiple tier cooling structure includes multiple tanks, multiple inlets, and multiple outlets. Each of the multiple tanks are on a respective tier, each of the multiple inlets are located on a first side at each tank to direct a cooling fluid from the first side of each tank to a second side. Each of the multiple outlets are located on the second side at each tank to direct an expulsion of the cooling fluid from each tank.

Abstract translation: 本文的实例公开了多层冷却结构。 多层冷却结构包括多个罐，多个入口和多个出口。 多个罐中的每一个在相应的层上，每个多个入口位于每个罐的第一侧，以将冷却流体从每个罐的第一侧引导到第二侧。 多个出口中的每一个位于每个罐的第二侧，以引导来自每个罐的冷却流体的排出。