公开(公告)号：US20220019198A1

公开(公告)日：2022-01-20

申请号：US17298525

申请日：2019-04-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： William J. Allen ,  David Murphy ,  Chin Kee Lim

IPC: G05B19/418

Abstract: In one example in accordance with the present disclosure, a method is described. According to the method, from assembly instructions for a multi-component device, component-specific assembly instructions are generated for a component. The component-specific assembly instructions include a portion of the assembly instructions that relate to the component. Data identifying the component-specific assembly instructions are encoded into a format to be formed onto the component and the encoded data is formed onto the component.